| 产品特性：EVG320 D2W | 加工定制：是 | 品牌：EVG |
| 型号：EVG320 D2W 混合键合面激活和清洁系统 | 用途：EVG320 D2W 混合键合面激活和清洁系统 | 别名：EVG320 D2W 混合键合面激活和清洁系统 |
| 规格：EVG320 D2W 混合键合面激活和清洁系统 |
EVG?320 D2W
Automated Die Preparation and Activation System
Industry’s first commercially available hybrid bond activation and cleaning system for direct placement (DP) die-to-wafer (D2W) bonding.
Features
The EVG320 D2W is a highly flexible platform that features a universal hardware/software interface to enable seamless integration with third-party pick-and-place die bonding systems. It also can operate as a stand-alone system depending on integration and line balancing requirements. The system incorporates EVG’s advanced cleaning and plasma activation technology, which is available across its industry-standard W2W fusion and hybrid bonding platforms and has been proven in hundreds of installed modules worldwide. In addition, the EVG320 D2W features EVG’s alignment verification module (AVM), an integrated metrology module that provides direct feedback to the die bonder on critical process parameters, such as die placement accuracy and die-height information as well as post-bond metrology, for improved process control. It also features flexible substrate handling that can accommodate any type of die carrier or film frame that can support plasma activation, hybrid and fusion bonding cleanliness standards, and SECS/GEM standard support.
Features
Up to six process modules
Fully automated cassette-to-cassette or FOUP-to-FOUP handling
Universal die carrier input including film frame and customized carrier formats
Universal hardware/software interface to enable seamless integration with third-party pick-and-place die bonding systems
Industry standard cleaning and activation modules for fusion and hybrid bonding
Metrology modules allowing feed-forward and feed-back loop to host and connected pick-and-place die bonding systems
GEMINI? FB
Automated Collective Die-to-Wafer Bonding System
High volume manufacturing system for collective die-to-wafer (Co-D2W) bonding
Features
A promising approach for hybrid D2W bonding is collective D2W (Co-D2W). In Co-D2W bonding, multiple dies are transferred to the final wafer in a single process step. The manufacturing flow for the Co-D2W bonding process consist of four major segments: carrier preparation, carrier population, wafer bonding and carrier separation. The EVG Gemini FB configured for D2W bonding is a decisive element in the Co-D2W integration flow, enabling efficient cleaning and transfer of carrier mounted dies, bonding and carrier detachment in one system. The Gemini FB system is industry standard for both wafer-to-wafer as well as Co-D2W fusion and hybrid bonding.
Features
Flexible handling of wafer and customized die carriers
Industry standard SmartView? NT face-to-face bond aligner for carrier to device wafer alignment
Up to six pre-processing modules:
Clean module
LowTemp? plasma activation module
Alignment verification module
Thermocompression bond module
XT Frame concept for highest throughput with EFEM (Equipment Frontend Module)
Software interfaces and integrated metrology functions allowing feed-forward and feed-back loop for efficient D2W overlay optimization
